Production capabilities
An engineer must be proficient in the capabilities of the technological process based on which the board will be manufactured. Compliance with technological standards at the design phase of a printed circuit board ensures its subsequent high-quality and reliable production, enables high volumes to be produced by minimizing defects, and also ensures the reliable functioning of the devices where the PCB is used. The above allows to reduce cost on both the product introduction phase and its operational phase.
For your convenience, we put the most important technological parameters into the table:
| Common parameters (single-, double- and multilayer printed circuit boards) | Value |
|---|---|
|
Board thickness, mm |
0,4-3,2 |
|
Copper thickness, μm |
9, 18, 35, 70, 1051 |
|
Maximum PCB dimensions, mm |
550,0 х 1150,0 |
|
Material |
FR1, FR2, FR4, CEM1, CEM3, halogen free; with index of CTI ≥ 400, ≥600; for RF and microwave freq. range (Rogers, Arlon); high Tg materials – up to 175 0C; metal core and other. 2 |
|
PCB outline processing |
routing, scoring (V-cut), punching |
|
Surface finishing |
HAL RoHS (Lead free), HAL SnPb, Immersion gold (ENIG), Immersion Tin, Gold Flash, Gold Fingers, carbone, OSP |
|
Legend colour |
white, black, yellow, green 3 |
|
Solder mask colour |
green, white, black (glossy and matte), red, blue 3 |
| Parameters | Typical | Advanced |
|---|---|---|
|
Multilayer PCB |
||
|
Number of layers |
4-14 |
4-28 |
|
Minimum conductor width4, mm |
0,1 |
0,076 |
|
Minimum conductors space4, mm |
0,1 |
0,076 |
|
Minimum space between conductor and board’s outline (outer layers / inner layers), mm |
0,5/0,5 |
0,3/0,5 |
|
Minimum hole size (mechanical drilling)6, mm |
0,2 |
0,2 |
|
Aspect ratio |
1:8 |
1:12 |
|
Minimum annular ring5, mm |
0,15 |
0,127 |
|
Blind vias |
yes |
yes |
|
Buried vias |
yes |
yes |
|
Minimum solder mask swell, mm |
0,05 |
0,05 |
|
Minimum solder mask bridge, mm |
0,1 |
0,1 |
|
Legend width (silkscreen), mm |
- |
0,1 |
|
Minimum legend symbol height (silkscreen), mm |
1,0 |
0,7 |
|
Multilayer HDI PCB |
||
|
Number of layers |
4-16 |
4-28 |
|
Build-up |
3-N-3 |
4-N-4 |
|
Minimum conductor width4, mm |
0,1 |
0,076 |
|
Minimum conductors space4 (outer layers / inner layers), mm |
0,1/0,076 |
0,076/0,064 |
|
Minimum space between conductor and board’s outline (outer layers / inner layers), mm |
0,5/0,5 |
0,3/0,5 |
|
Minimum hole size (laser drilling), mm |
0,1 |
0,075 |
|
Minimum annular ring5 (outer layers / inner layers), mm |
0,15/0,1 |
0,127/0,1 |
|
Via-in-pad technology |
yes |
yes |
|
Stacked and staggered micro vias |
yes |
yes |
|
Copper plugged vias |
yes |
yes |
|
Resin plugged vias |
yes |
yes |
|
Minimum solder mask swell, mm |
0,05 |
0,025 |
|
Minimum solder mask bridge, mm |
0,1 |
0,1 |
|
Double sided PCB |
||
|
Minimum conductor width4, mm |
0,15 |
0,1 |
|
Minimum conductors space4, mm |
0,15 |
0,1 |
|
Minimum space between conductor and board’s outline, mm |
0,5 |
0,3 |
|
Minimum hole size, mm |
0,3 |
0,2 |
|
Aspect ratio |
1:8 |
1:12 |
|
Minimum annular ring5, mm |
0,2 |
0,15 |
|
Minimum solder mask swell, mm |
0,1 |
0,05 |
|
Minimum solder mask bridge, mm |
0,15 |
0,1 |
|
Legend width (silkscreen), mm |
- |
0,1 |
|
Minimum legend symbol height (silkscreen), mm |
1,0 |
0,7 |
|
Single sided PCB |
||
|
Minimum conductor width4, mm |
0,2 |
0,15 |
|
Minimum conductors space4, mm |
0,2 |
0,15 |
|
Minimum space between conductor and board’s outline, mm |
0,5 |
0,3 |
|
Minimum hole size, mm |
0,5 |
0,4 |
|
Minimum annular ring5, mm |
0,3 |
0,2 |
|
Minimum solder mask swell, mm |
0,1 |
0,05 |
|
Minimum solder mask bridge, mm |
0,2 |
0,1 |
|
Legend width (silkscreen), mm |
- |
0,1 |
|
Minimum legend symbol height (silkscreen), mm |
1,5 |
1,0 |
|
Flex PCB |
||
|
Number of layers |
1-6 |
|
|
Material |
Polyimide, PET |
|
|
Minimum conductor width4, mm |
0,15 |
0,1 |
|
Minimum conductors space4, mm |
0,15 |
0,1 |
|
Minimum space between conductor and board’s outline, mm |
0,5 |
0,25 |
|
Minimum hole size, mm |
0,3 |
0,2 |
|
Coverlay swell (coverlay to soldering pad gap), mm |
0,2 |
0,1 |
|
Aluminum core PCB |
||
|
Number of layers |
1-2 |
1-4 |
|
Board thickness, mm |
0,5-3,2 |
|
|
Copper thickness, μm |
35 |
|
|
Dielectric thickness, μm |
50, 75, 100, 150 |
|
|
Thermal conductivity, W/mK |
0,7-4 |
|
|
Breakdown voltage, kV |
2-12 |
|
|
Maksimum PCB dimensions, mm |
550,0 х 950,0 |
|
|
Material |
AL 5052 |
|
|
Minimum conductor width4, mm |
0,2 |
0,15 |
|
Minimum conductors space4, mm |
0,2 |
0,15 |
|
Minimum space between conductor and board’s outline, mm |
0,5 |
0,25 |
|
Minimal hole size, mm |
0,9 |
0,6 |
|
Minimum solder mask swell, mm |
0,15 |
0,05 |
1 It is possible to make thicker copper on demand.
2 Other materials on demand.
3 Other colours on demand.
4 For copper thickness 9 μm and 18 μm.
5 (Pad size – hole size)/2
6 It is possble to use laser drilling on demand.
Minimum clearances for different cooper thicknesses
| Finished copper thickness, μm | 35 | 70 | 105 | 140 | 210 |
| Minimum Trace, mm | 0,1 | 0,20 | 0,23 | 0,30 | 0,60 |
| Minimum clearance, mm | 0,1 | 0,20 | 0,24 | 0,35 | 0,70 |
| Finished copper thickness, μm | 35 | 70 | 105 | 140 | 210 |
| Minimum Trace, mm | 0,1 | 0,20 | 0,27 | 0,34 | 0,60 |
| Minimum clearance, mm | 0,1 | 0,20 | 0,30 | 0,45 | 0,85 |